For PTFE, a tie layer resin is often an uncured resin like a phenoxy or polyimide layered in, something that will bond to the activated PTFE surface
and the foil under extreme heat and pressure. It's usually pretty thin so it doesn't make an enormous impact on the dielectric properties of the
board.
The can o' stuff won't be nearly sufficient to get Teflon to bond a foil layer that will stand up to flexing and heat. You really do need a STRONG
free radical source (not to mention a press that will take the resins to a cure state and apply enough pressure), and that means specialized
techniques and equipment.
Or you could do what auplater suggests, do a sputtered or CVD conductive layer, then plate it up to the thickness you need.
This is not diy stuff. |